Sputter
M/N: The1-MSS1
01. Feature of Sputtering System
- Deposition thickness: Customer specified
- Deposition material: Metals & Oxides films
- Film thickness uniformity: ≤ ± 5 % on 2” substrate
- Deposition: deposition by Sputtering gun 3”
- Throughput: up to 4” substrate x 1 sheet / batch
- Vacuum: Ultimate pressure 5.0 x 10-6 Torr
Base pressure 3.0 x 10-5 Torr - Vacuum chamber: Process chamber
- Control system: Manual control
- Purpose: Research and development
02. Options (선택시 추가)
- Substrate mask holder
- Substrate rotation
- Turbo molecular pump
- Baratron gauge module
M/N: The1-MSS2
01. Feature of Sputtering System
- Deposition thickness: Customer specified
- Deposition material: Metals & Oxides films
- Film thickness uniformity: ≤ ± 5 % on 3” (with rotation) substrate
- Deposition: deposition by Sputtering gun 3” (2 guns)
- Throughput: up to 4” substrate x 1 sheet / batch
- Vacuum: Ultimate pressure 5.0 x 10-6 Torr
Base pressure 3.0 x 10-5 Torr - Vacuum chamber: Process chamber
- Control system: Manual control
- Purpose: Research and development
02. Options (선택시 추가)
- Substrate mask holder
- Substrate rotation
- Turbo molecular pump
- Baratron gauge module
